EDI CON USA 2018 News

EDI CON USA Announces Outstanding Paper Winners

November 15, 2018 (Norwood, Mass.) - October 10, 2018 (Norwood, Mass.) - EDI CON USA, the industry event for RF/microwave and high-speed digital design engineers and system integrators took place in Santa Clara Convention Center on October 17 and 18. As part of its technical program, EDI CON USA presents its Outstanding Paper Awards. The papers are judged for technical merit by the EDI CON USA Technical Advisory Committee, and the winners and finalists are celebrated in a ceremony at the event.

“This year’s competition was particularly challenging,” noted Technical Program Director, Janine Love, “and we had more finalists than in the past. All of the event team extends our sincere appreciation to the authors, presenters, and Technical Advisory Committee for their impressive work this year.”

Congratulations to the winners: 
Simulation and Modeling
Causality in Power Delivery Network (PDN) Extractions in Package & Board
Vinod Arjun Huddar (Western Digital)

5G and Advanced Communications
Realistic Antenna Array Modeling for 5G Communications
Laila Salman (ANSYS Canada)

mmWave
Advances in Technology and Design of UWB mmWave Planar and Non-Planar Diplexers for Applications up to 100GHz
Irfan Ashiq (NI Components)

RF and Microwave Design
Optimization Approaches for Digital Controlled Tunable Filters for Receivers
Yarkin Yigit (ASELSAN) and Erdem Yazgan (TED University)

Signal Integrity
IEEE P370:  A Fixture Design and Data Quality Metric Standard for Interconnects up to 50 GHz
Jay Diepenbrock (SIRF Consultants)

Test and Measurement
High Speed/mm-wave Measurement-Based Model Development: Uncertainties and Model Sensitivities
Jon Martens (Anritsu)

Power Integrity Finalist 
The 2-Port Shunt-Thru Measurement and the Inherent Ground Loop
Anto Davis and Steve Sandler (Picotest)

EDI CON China takes place in Beijing, China April 1-3, 2019. That Call for Papers is now open. EDI CON USA returns to the Santa Clara Convention Center on September 10-11, 2019.

About EDI CON USA 
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification. www.ediconusa.com

About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave JournalSignal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (April 16-18, 2019). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA). To subscribe to Signal Integrity Journal, visit www.signalintegrityjournal.com. To subscribe to Microwave Journal, visit http://www.mwjournal.com

EVENT CONTACT:
Janine Love, Event Director
+1-857-350-2216
jlove@horizonhouse.com
Twitter: @tb_janine

SALES CONTACT:
Carl Sheffres, Exhibition Manager 
+1-781-619-1949
csheffres@mwjournal.com