September 7, 2018 (Norwood, Mass.) - Mini-Circuits is pleased to announce a new partnership with 3D imaging sensor company Vayyar Imaging to offer microwave transceiver project kits with broad applicability for students and university programs spanning topics in electromagnetic theory, RF/microwave engineering, RF systems and radar technology. The first project kit, UVNA-63 includes all the elements students need to build a fully functioning vector network analyzer, develop S-parameter algorithms, and perform real-time measurements of 2-port RF devices. The kit comprises Vayyar's high-performance transceiver chip with a variety of RF components from Mini-Circuits along with control software, and a development environment for Python and MATLAB®. The project addresses a gap in most RF curricula between classroom theory and the sophisticated equipment engineers use in the lab to perform complex measurements with the push of a button.
Mini-Circuits President, Ted Heil commented, “Mini-Circuits has always been committed to supporting the academic community in cultivating the next generation of RF engineering talent. We believe this powerful, hands-on learning tool will help bridge the gap between textbook S-parameter theory and practical measurements in the lab, serving to better educate engineers on the challenges and wonders of the RF world.”
CEO of Vayyar, Raviv Melamed commented, “Following in the tradition of Mini-Circuits founder Harvey Kaylie, Vayyar is proud to be helping make RF accessible to all. The VNA Kit unlocks the ability to learn by doing, as students engage with the fundamentals of RF."
UVNA-63 vector network analyzer project kits are available now for pre-order and will be delivered in September, toward the onset of the new semester. Pre-orders may be placed on the Mini-Circuits website, or by contacting our team directly.
Kits will be featured at Mini-Circuits sponsored EDI CON University session, "Build Your Own VNA," at EDI CON USA 2018 on Thursday, October 19 from 9-11 am, Santa Clara, Calif.
About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification. www.ediconusa.com
About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (April 16-18, 2019). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA). To subscribe to Signal Integrity Journal, visit www.signalintegrityjournal.com. To subscribe to Microwave Journal, visit http://www.mwjournal.com.
Janine Love, Event Director
Carl Sheffres, Exhibition Manager