EDI CON USA 2018 News

EDI CON USA 2018 Announces Technical Program Chairs

Jin Bains and Ransom Stephens join the team to shape this year’s conference in Santa Clara, CA.

February 28, 2018 (Norwood, Mass.) - Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the industry event that brings together RF/microwave and high-speed digital design engineers and system integrators, is happy to announce its technical program co-chairs for the 2018 USA event.

Jin Bains, Head of Connectivity, SCL, at Facebook and Ransom Stephens, PhD, Author, Technologist, and Physicist, have agreed to help steer the direction of this year’s conference. Bains is an expert in RF/microwave industry, and Stephens is expert in high-speed electronics. They are part of the EDI CON USA Technical Advisory Committee, which reviews abstracts for inclusion in the technical program as well as evaluates all submitted papers for consideration of an Outstanding Paper Award.

In his current role at Facebook, Bains oversees and directs engineering teams involved in the company’s efforts to increase access to affordable connectivity across the globe, including the use of terrestrial, low-altitude, high-altitude, and satellite systems. Before joining Facebook, he spent over ten years at National Instruments, where he served as the Vice President of R&D, RF and Wireless Products, managing a global R&D organization of engineers and driving innovation with internal experts and key outside partners. Bains began his career as an RF Engineer and R&D manager for Hewlett Packard and Agilent Technologies. He holds a BS and MS in Electrical Engineering from UC Davis and Stanford, respectively.

Ransom Stephens, Ph.D. aims to help engineers by teaching the concepts they need to design better systems and better ways to come up with solutions. He began his career in basic research at labs in the US and Europe specializing in digging weak signals out of strong backgrounds. He brought those skills to high-speed electronics in 1999 and invented new techniques for signal and noise analysis. Since 2005, when he started Ransom’s Notes, his seminars have helped thousands of EEs understand key nuances of their work. He is also an accomplished book author: the novels The God Patent and The Sensory Deception have each appeared on a variety of bestseller lists. He released his first full-length work of nonfiction popular science, The Left Brain Speaks the Right Brain Laughs in 2016. Stephens holds a Ph.D. in physics from the University of California.

This year’s EDI CON USA event, held at the Santa Clara Convention Center October 17-19, will focus on education and training for attendees, as well as include a celebration of innovation in the EDI CON EXPO hall, complete with show-floor networking opportunities, prizes, and speed trainings.

EDI CON is a unique event because it brings together two groups of engineers—high-frequency and high-speed—who are finding that the overlap between their solutions and challenges Is growing each year. Its strength is that it is produced by the leading technical journals in each of these respective domains, the Microwave Journal and the Signal Integrity Journal. Now in its third year in the US and 6th year in China, EDI CON is proving to be a fantastic opportunity for learning, training, networking, and knowledge sharing.

The Call for Abstracts for EDI CON USA 2018 is open until May 3rd. Track selections include RF & Microwave Design, Mobile Front End Design, Low Power RF & IoT, 5G Advanced Communications, Broadband Networks, Radar & Defense, Amplifier Design, Signal Integrity, Power Integrity, EMC/EMI, Simulation & Modeling, and Test & Measurement. Selected papers will be presented at EDI CON USA 2018, held October 17-19, 2018 at the Santa Clara Convention Center, Santa Clara, CA.

More information and the submission portal is available online
EDI CON USA 2018 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal. More information, including how to exhibit at EDI CON USA 2018, is available at http://www.ediconusa.com.


EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification. www.ediconusa.com
About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (March 20-22, 2018 in Beijing, China). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA). To subscribe to Signal Integrity Journal, visit www.signalintegrityjournal.com. To subscribe to the Microwave Journal, visit http://www.mwjournal.com.

Janine Love, Event Director
Twitter: @tb_janine

Carl Sheffres, Exhibition Manager