EDI CON USA 2018 News

EDI CON USA 2018 Opens Call for Abstracts

January 29, 2018 (Norwood, Mass.) - The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the industry event that brings together RF/microwave and high-speed digital design engineers and system integrators, has opened the Call for Abstracts for EDI CON USA 2018. Selected papers will be presented at EDI CON USA 2018, held October 17-18, 2018 at the Santa Clara Convention Center, Santa Clara, CA.

Track selections include RF & Microwave Design, Mobile Front End Design, Low Power RF & IoT, 5G Advanced Communications, Broadband Networks, Radar & Defense, Amplifier Design, Signal Integrity, Power Integrity, EMC/EMI, Simulation & Modeling, and Test & Measurement.

This year’s Technical Advisory Committee (TAC) is led by co-chairs Jin Bains, Head of Connectivity, SCL, at Facebook, and Ransom Stephens, Ph.D., author, technologist, and physicist. The EDI CON USA 2018 TAC will evaluate submitted abstracts based on quality, relevance, impact, and originality. To be accepted, submissions must be high quality and comprehensive, aimed at advancing the knowledge of attendees.

“EDI CON technical sessions are educational, providing practical information on how to address today’s design challenges using available materials, tools, products, and techniques,” said Janine Love, Event Director. “We are looking forward to putting on another engaging and constructive conference and exhibition for engineers working on the latest RF, microwave, and digital designs.”

The Call for Abstracts closes May 31, 2018. More information and the submission portal is available online.
EDI CON USA 2018 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal. More information, including how to exhibit at EDI CON USA 2018, is available at http://www.ediconusa.com. EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara, CA) on October 17-18, 2018.


EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification. www.ediconusa.com
About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (March 20-22, 2018 in Beijing, China). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA). To subscribe to Signal Integrity Journal, visit www.signalintegrityjournal.com. To subscribe to the Microwave Journal, visit http://www.mwjournal.com.

Janine Love, Event Director
Twitter: @tb_janine

Carl Sheffres, Exhibition Manager