EDI CON USA 2017 News

EDI CON Adds IBIS Summit to Its Premier Program Line-Up

IBIS Open Forum Calls for Participation and Presentations

August 9, 2017 (Norwood, Mass.) - The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced today that IBIS Open Forum will hold its first, formal IBIS Summit Meeting at EDI CON USA 2017 at the Hynes Convention Center, September 11-13 in Boston, MA.

IBIS summits are intended to promote exchanges of ideas and methods among users and developers of IBIS models and associated tools in Europe. “The IBIS standards and specifications are used in the development of nearly all digital electronic devices,” said Mike LaBonte, IBIS Forum Chair. “Since 1993, 74 IBIS Summit meetings have been held worldwide by the IBIS Open Forum (ibis.org) to continue the technical discussions that help IBIS models keep pace with new high-speed digital signaling technologies. We welcome the opportunity to meet with the many system designers, silicon vendors, and EDA vendors who use, produce, and simulate IBIS models, at EDI CON in Boston this year.”

CALL FOR PARTICIPANTS
People involved in IBIS Model development, EDA tool development, and digital circuit design are invited to participate. To participate, send your name, email and company name to Lance Wang (lwang@iometh.com). Deadline to submit your interest is September 6.

CALL FOR PRESENTATIONS
IBS Open Forum is seeking presentations from individuals who have IBIS experience or issues. Suggested subjects of interest include: IBIS model development, company IBIS standards and requirements, generating & validating IBIS models, future IBIS developments and requirements (e.g., IBIS-AMI), modeling of dedicated technology issues (e.g., connectors, and very high-speed interfaces), EMC/EMI and power integrity issues, related modeling issues (e.g., SPICE, S-Parameter modeling), and experiences using IBIS in the PCB design process. To present, send your name, email, company name, presentation title and time required to Bob Ross (bob@teraspeedlabs.com). Deadline to submit your information is August 30. Presentations will be reviewed by the IBIS Open Forum Board for appropriateness before being accepted.  

The IBS Summit at EDI CON USA is free and open to everyone (EDI CON EXPO pass or conference pass required) and will be held Wednesday, September 13, from 13:00-17:00, room 104 at the Hynes Convention Center. The agenda includes presentations, discussions, breaks and refreshments. A complete agenda will be posted one week prior to the event to members.

EDI CON USA 2017 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal. More information, including how to register for EDI CON USA 2017, is available at http://www.ediconusa.com. For future planning, EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara, CA) on October 17-19, 2018.

About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification.

About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (April 25-27, 2017 in Shanghai, China). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and the M2M Zone at CTIA Super Mobility Week/Mobile World Congress Americas.
The EDI CON technical program is developed in collaboration with leading international technology companies and experts in high-frequency and high-speed electronic design with experience ranging from modeling and design to component characterization, system integration, and verification.

EVENT CONTACT:
Janine Love, Event Director
+1-857-350-2216
jlove@horizonhouse.com
Twitter: @tb_janine

SALES CONTACT:
Carl Sheffres, Publisher
+1-781-619-1949
csheffres@mwjournal.com

EDITORIAL CONTACTS:
North America:
Pat Hindle
+1 781-619-1946
PHindle@MWJournal.com
Twitter: @pathindle

International:
Richard Mumford
+44 207 596 8787
RMumford@MWJournal.com