EDI CON USA 2017 News

EDI CON USA 2017 Launches Scholarship Program

Open to any student interested in high frequency or high-speed electronics

August 2, 2017 (Norwood, Mass.) - EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, announces a new scholarship program for university students interested in high frequency or high-speed electronics. Any student that attends EDI CON USA 2017 can enter the drawing for a one of two $500 scholarships being given away by visiting the booths of three major sponsors in the exhibition Sept 12-13. The Gold level or higher sponsors include Analog Devices, Rohde & Schwarz, National Instruments, Anritsu and RF Lambda. All students will get free admission to the event using a special promo code and can attend conference sessions, workshops and the industry exhibition. Students can learn from the conference and workshops, ask questions to the various experts at the event, and visit companies in the industry to discuss products and career oppportunties.

EDI CON USA 2017 takes place at the Hynes Convention Center, September 11-13 in Boston, Mass. with session tracks covering RF/microwave, high-speed digital and EMC/EMI topics. The event will feature a 3-day conference, with extended tutorials and short courses on Monday, September 11, followed by technical sessions, invited talks, workshops, and panels on Tuesday and Wednesday. The technical sessions focus on actionable, educational information for working engineers rather than product pitches and commercial presentations.

EDI CON USA 2017 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal. More information, including how to exhibit at EDI CON USA 2017, is available at http://www.ediconusa.com. For future planning, EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara, CA) on October 17-18, 2018.

EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification.

About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (April 25-27, 2017 in Shanghai, China). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and the M2M Zone at CTIA Super Mobility Week/Mobile World Congress Americas.
The EDI CON technical program is developed in collaboration with leading international technology companies and experts in high-frequency and high-speed electronic design with experience ranging from modeling and design to component characterization, system integration, and verification.

Janine Love, Event Director
Twitter: @tb_janine

Carl Sheffres, Publisher

North America:
Pat Hindle
+1 781-619-1946
Twitter: @pathindle

Richard Mumford
+44 207 596 8787