EDI CON USA 2017 News

HIGH-SPEED DIGITAL SYMPOSIUM LAUNCHES AT EDI CON USA 2017

Day two of the three-day conference includes an afternoon symposium on material characterization challenges in high-speed digital design led by session chair Eric Bogatin.

July 6, 2017 (Norwood, Mass.) - The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced today the addition of a the High-Speed Digital Symposium to its conference line up during the event at the Hynes Convention Center, September 11-13 in Boston, MA. Eric Bogatin, Editor of Signal Integrity Journal, Dean of the Signal Integrity Academy, and an adjunct professor at the University of Colorado, has organized the symposium at this year’s event.

“Many high-speed serial links above 15 Gbps are pushing against fundamental material limits in the interconnects. This means designs living on the edge can ‘fall off the cliff’ if the material properties used in the design are optimistic. How do we gain confidence in the values of the material properties in the manufactured product? What input information do we need to accurately design robust high-speed channels and how do we test the simulations? These topics will be addressed by industry experts at this symposium,” explains Bogatin.

 

Scheduled presentations include:

  • “Insitu Glass Fabric Characterization,” Brandon Gore and Scott McMorrow, SAMTEC Inc.
  • "Extraction of Frequency-Dependent Dielectric Constant: Loss and conductor effects of high-speed digital laminate materials for high-speed channel simulation,” Chris Caisse, Allen F. Horn, and Patricia LaFrance, Rogers Corporation.
  • “Test Vehicle Development for Systematic Development and Verification of Materials Models to 50 GHz,” Alfred P. Neves, Founder and Chief Technologist at Wild River.
  • “A Case Study of Effective Surface Roughness Acquisition,” Jason Ellison, The Siemon Company.
  • “Practical Modeling of High-Speed Channels Based on Data Sheet Input,” Bert Simonovich, Lamsim)
  • Panel Discussion wrap up on and Q&A on practical approaches to accurate channel simulation with all the presenters, moderated by Eric Bogatin.

Attendees will require a conference pass to attend these sessions.

EDI CON USA 2017 is building on its inaugural 2016 conference with multiple parallel tracks covering RF/microwave, high-speed digital and EMC/EMI topics. The conference features extended short courses on Monday, September 11 followed by this symposium, the European RADAR summit, technical sessions, a plenary session, invited talks, workshops, panels and exhibition on Tuesday and Wednesday. Technical sessions focus on actionable, educational information for working engineers rather than product pitches and commercial presentations. The entire technical program can be previewed here.

This year, EDI CON USA is the biggest RF/microwave industry conference and exhibition in the continental USA, and the largest high-speed industry conference on the US East Coast. Networking opportunities will abound on the exhibit floor, and attendees can enjoy a welcome reception and happy hour. More information, including registration and how to exhibit, is available at www.ediconusa.com. EDI CON USA 2017 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal. For future planning, EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara, CA) October 17-19, 2018.


About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification.

About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (April 25-27, 2017 in Shanghai, China). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and the M2M Zone at CTIA Super Mobility Week/Mobile World Congress Americas.
The EDI CON technical program is developed in collaboration with leading international technology companies and experts in high-frequency and high-speed electronic design with experience ranging from modeling and design to component characterization, system integration, and verification.

EVENT CONTACT:
Janine Love, Event Director
+1-857-350-2216
jlove@horizonhouse.com
Twitter: @tb_janine

SALES CONTACT:
Carl Sheffres, Publisher
+1-781-619-1949
csheffres@mwjournal.com

EDITORIAL CONTACTS:
North America:
Pat Hindle
+1 781-619-1946
PHindle@MWJournal.com
Twitter: @pathindle

International:
Richard Mumford
+44 207 596 8787
RMumford@MWJournal.com