January 26, 2017 (Norwood, Mass.) - EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, will take place at the Hynes Convention Center, September 11-13 in Boston, MA. The event management team is pleased to announce this year’s call for abstracts (CFA) is now open. The EDI CON USA Technical Advisory Committee, event management team, and this year’s conference chairs, Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. and Istvan Novak, Senior Principal Engineer at Oracle, worked in conjunction to develop the CFA. Potential speakers can submit abstracts in 12 tracks, vying for speaking slots in technical sessions at the conference as well as an EDI CON USA Outstanding Paper Award.
EDI CON USA 2017 will feature a 3-day conference, with extended tutorials and short courses on Monday, September 11, followed by technical sessions, invited talks, workshops, and panels on Tuesday and Wednesday. The technical sessions focus on actionable, educational information for working engineers rather than product pitches and commercial presentations. The CFA process determines the content of the technical sessions, and all submitted abstracts are reviewed by the EDI CON USA Technical Advisory Committee, a group of leading experts in RF/microwave and high-speed digital design who carefully review and rate each abstract for quality, relevance, and impact.
This year’s planned tracks include:
For specific paper topic suggestions, see the full length Call for Abstracts here: http://www.ediconusa.com/callforpapers.asp. Abstracts are due by April 3, 2017.
This year, EDI CON USA is the only RF/microwave industry conference and exhibition in the continental USA, and the largest high-speed technical conference on the US East Coast. Networking opportunities will abound on the exhibit floor, and attendees can enjoy a welcome reception and happy hour. So, save the date, submit your abstracts, and make plans to attend and participate in the second annual EDI CON USA!
EDI CON USA 2017 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal.
More information, including how to exhibit for EDI CON USA 2017, is available at http://www.ediconusa.com. For future planning, EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara, CA) on October 17-19, 2018.
About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification.
About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (April 25-27, 2017 in Shanghai, China). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and the M2M Zone at CTIA Super Mobility Week/Mobile World Congress Americas.
The EDI CON technical program is developed in collaboration with leading international technology companies and experts in high-frequency and high-speed electronic design with experience ranging from modeling and design to component characterization, system integration, and verification.
Janine Love, Event Director
Carl Sheffres, Publisher
+44 207 596 8787