EDI CON USA 2016 News

EDI CON USA Completes Successful Inaugural Event


September 29, 2016 (Norwood, Mass.) - EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, had a successful inaugural event in the US on September 20-22 in Boston, MA.

"We are very pleased with our first EDI CON USA, which exceeded our expectations in number of exhibitors and submitted abstracts for the conference program. We appreciate the support of the EDI CON USA exhibitors, received very positive feedback from conference attendees, and look forward to building on these strengths for next year," said Ivar Bazzy, President of Horizon House, the conference's organizer. "Our attendance exceeded that of our first event in China, which has experienced double digit growth year on year. We expect the same type of trajectory for our US event." EDI CON China will hold its fifth event April 25-27, 2017, in Shanghai, China.

The technical sessions were organized around tracks focused on RF, microwave, and high-speed digital design (including signal integrity, power integrity, and EMC/EMI), modeling and measurement topics. The event also saw the launch of a new publication, The Signal Integrity Journal, which serves the signal integrity, power integrity, and EMC/EMI fields.

Next year's event, EDI CON USA 2017, will be held at the Hynes Convention Center (Boston, MA) on September 11-13, 2017. EDI CON USA 2018 will be held at the Santa Clara Convention Center on October 17-18, 2018. More information, including how to exhibit for EDI CON USA 2017, is available at http://www.ediconusa.com.


EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries.
Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that will address all aspects of design, simulation, test, and verification.

About the Organizers
EDI CON USA is organized by Microwave Journal and the event planning division of its parent company, Horizon House. Microwave Journal and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China. An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and several major microwave related conferences/exhibitions such as the M2M and Mobile Backhaul Zones at CTIA Super Mobility. The EDI CON program is developed in collaboration with leading international technology companies and experts in high-frequency and high-speed electronic design with experience ranging from modeling and design to component characterization, system integration, and verification.

Janine Love, Event Director
Twitter: @tb_janine

Carl Sheffres, Publisher

North America:
Pat Hindle
+1 781 619 1946
Twitter: @pathindle
Richard Mumford
+44 207 596 8787