EDI CON USA 2016 News

EDI CON USA Announces 2016 Gold Sponsors for Event in Boston, MA

May 16, 2016 (Norwood, Mass.) - EDI CON USA 2016, EDI CON USA today announced the Gold Sponsors for its next event taking place September 20-22 at the Hynes Convention Center in Boston, Mass. These sponsors will be highlighted throughout the EDI CON USA 2016 conference and exhibition, which is specifically organized for engineers working on high-frequency analog and high-speed digital designs.

This year’s Gold Sponsors for EDI CON USA include Computer Simulation Technology AG (CST) (Framingham, MA) and Mini-Circuits (Brooklyn, NY). They join Host Sponsor Keysight Technologies, Diamond Sponsor Rohde & Schwarz, and Corporate Sponsor National Instruments/AWR as leading participants in the event.

“One of the unique features of EDI CON is its focus on providing information for practicing engineers, and that leading experts from the exhibition hall are also giving technical talks in the conference,” said Event Director, Janine Love. “With this close connection between exhibition and conference, attendees benefit from seeing demonstrations on the show floor that directly relate to the discussions they were engaged in during the conference sessions, leading to opportunities for new ideas and effective networking.”

EDI CON USA exhibition attendees will be able to see demonstrations of the latest products and methodologies for high-frequency analog and high-speed digital designs on the show floor, which will include exhibits, demonstrations in the Signal Integrity Zone, educational talks and training in the Frequency Matters Theater, networking events, and poster sessions. In addition, conference attendees will be able to participate in technical sessions, workshops, short courses, panel discussions, and keynote talks.

The exhibition floor is newly expanded, and sponsorships are still available for companies interested in participating in this event. Information about exhibition space and sponsorship is available at http://www.ediconusa.com/. Conference registration will open in June 2016. More information is available at http://www.ediconusa.com/. For help with participating, contact Carl Sheffres at csheffres@mwjournal.com.

EDI CON USA is a technical conference and exhibition that is designed for engineers and system integrators working with current technologies and methodologies to develop the electronic systems required today. Building on four successful years in China, the EDI CON event platform is launching in the USA starting in Boston, Mass. where there is a high concentration of electronic design engineers including both high-frequency and high-speed digital designers working in the commercial as well as aerospace markets. Organizers expect to attract more than 3,000 attendees during the 3-day event with close to 100 technical presentations, including workshops, short courses, and panels. The technical sessions will be arranged around tracks that are focused on RF & microwave design, high-speed digital design, measurement & modeling, systems engineering, and 5G advanced communications.

About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries.
Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that will address all aspects of design, simulation, test, and verification.

About the Organizers
EDI CON USA is organized by Microwave Journal and the event planning division of its parent company, Horizon House. Microwave Journal and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China. An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and several major microwave related conferences/exhibitions such as the M2M and Mobile Backhaul Zones at CTIA Super Mobility. The EDI CON program is developed in collaboration with leading international technology companies and experts in high-frequency and high-speed electronic design with experience ranging from modeling and design to component characterization, system integration, and verification.


EVENT CONTACT:
Janine Love, Event Director
+1-857-350-2216
jlove@horizonhouse.com

SALES CONTACT:
Carl Sheffres, Publisher
+1-781-619-1949
csheffres@mwjournal.com

EDITORIAL CONTACTS:
North America:
Pat Hindle
+1 781 619 1946
PHindle@MWJournal.com
Twitter: @pathindle
International:
Richard Mumford
+44 207 596 8787
RMumford@MWJournal.com