Short Courses EDI CON USA 2017: Monday Sept 11, 2017


This special Monday Training Event requires a conference pass and is made up of 3-hour intensive short courses in the morning and afternoon. Come bring your questions and your curiosity. The day includes an evening reception and a luncheon (registration required.)

 

Planned courses include:

Five Steps to Engineer Transparent Vias in High-Speed Circuit Boards, Eric Bogatin; Sponsored by Mentor Graphics, a Siemens Company
Vias are a necessary part of all high density designs. If attention is not paid to their design, they can also be the biggest source of problems in high speed designs. In this 3-hour tutorial we will identify the five most important design guidelines to follow to engineer transparent vias, so they do not contribute to reflection noise or channel to channel cross talk. We will introduce the best design practices for both single-ended and differential vias.

Transferring Board Design into PCB Design: Get it Right the First Time Shalom Shlomi Zigdon
The final system performance and reliability is a result of the design of the printed circuit board [PCB]. It makes the PCB Design for Signal Integrity & EMC to be as important as the circuit [Board] design. As the board designer has the full responsibility for the PCB Design, it is important to get it right the first time.
This short but intensive course provides practical guidelines and suggestions for digital/analog/RF mixed-signal printed-circuit board (PCB) design and layout. It will help the designer to find the "Eutectic Point" of he mixed signals, by considering the cost/performance trade off for each parameter, effecting the performance, reliability and cost of the design. Topics includes distributed circuits and lossless transmission lines, non-ideal transmission line effects, crosstalk mitigation, differential pairs and RF circuit. Selection and design of the right stack-up to ensure EMC, signal & power Integrity, Component placement of signal transmitter and receiver circuits, ADC, DAC, analog & RF components, Impedance controlled design of traces, routing of high-speed serial signals, minimizing crosstalk between the signal channels and board level filtering and decoupling.

Practical Antenna Design for Wireless Products, Henry Lau, Lexiwave Technology, Inc.
To stay competitive in today’s fast evolving business environment, short time-to-market is a must for any wireless product developments. Playing a critical role in determining the communication range of products, RF design, particularly the antenna design, becomes crucial to the success of the introduction of new wireless products. Competence in advanced antenna designs can definitely strengthen the competitive edge of wireless product design or manufacturing companies. This short course covers the fundamental antenna concepts and definitions, specifications and performance of different types of commonly-used and advanced antennas in wireless products. It aims to provide participants with technical insights on the vital aspects of antenna design from a practical and industrial perspective. Simulation tools will be introduced and discussed. Practical implementation strategies for optimum antenna performance in wireless products will also be presented.

Power Integrity 101, Steve Sandler, Founder, Picotest
Power Integrity (PI) is essential tool for ensuring proper performance of high-speed circuits as well as sensitive circuits, such as clocks, transceivers, ADCs and LNAs. Unfortunately, the assessment is complex and for those just getting started, it can seem overwhelming. This tutorial addresses power integrity right from the very beginning with no prior knowledge or experience required. If you are just getting started in PI, just curious or want to learn how power integrity intersects with signal integrity this session is for you.

You’ll learn about these topics and more:

  • What is PI and how does it impact me
  • PI isn’t just about high speed or high power
  • Decoupling isn’t arbitrary
  • Why excellent transient response can be a very bad thing
  • Simulating PI end-to-end

Radar, Phased-Arrays, Metamaterials and MIMO – Basics, Advances And Breakthroughs, Dr. Eli Brookner, Retired, Raytheon
The tutorial will be geared to those unfamiliar and experienced with phased arrays. First, we will do a short tutorial on array basics: Phase and time delay scanning, thinned arrays, array elements, mutual coupling, array errors, frequency scanning. Followed by latest developments and future trends in: GaN power amplifiers, MMIC and Extreme MMIC microwave circuit integration, AESA and T/R module cost reduction, silicon RF performance to >100 GHz, potentials for Moore’s law continuation, electro-optic integration, digital beamforming (DBF), new materials: metamaterial (for low cost ESAs, stealthing) , graphene (for THz clock speed) and carbon nanotubes, and new MIMO phased arrays.

Practical Board Level Power Integrity Measurement and Design Principles, Eric Bogatin; Sponsored by Teledyne LeCroy
The ideal power rail produces a stable DC voltage with no voltage noise and zero output impedance. Enter the real world. How non-ideal is your power rail? Even the process of measuring its voltage can affect what you measure. How much noise is there under load conditions and what elements in your product are affected by the voltage noise? What is the output impedance and what can be done at the board level to improve the performance of the power distribution network, for which the voltage regulator is part? In this short course we will illustrate some of the best design and measurements practices for probing the voltage rails on a board, interpreting the measurements which characterize the VRM and its impact on board components, and what we can do at the board level to improve performance. This workshop will illuminate the principles, tips and tricks for more productive power rail measurements and troubleshooting.

RF & Bench Essentials for IoT Device Debugging, Greg Bonaguide; Sponsored by Rohde & Schwarz
Wireless and RF technology has rapidly entered many traditionally digital products. IoT is everywhere and now engineers need to utilize a lab bench that includes both RF and time domain instruments. This workshop will train attendees in some key concepts of test and measurement as well as the basics of board bring-up and debug. Attendees will learn how to debug IoT devices using instruments including spectrum analyzers, VNAs, oscilloscopes and modern power supplies. The day starts with some expert lead instruction and then focuses on hands-on-labs where attendees will bring-up, measure and debug a Bluetooth Low Energy development system.

Topics Include:

  • Introduction to IoT and Bluetooth Low Energy (BLE) with T&M Fundamentals
  • Introduction to the device under test (DUT).
  • Functionality and high level schematics of the BLE development system, including the measurement and debug task at hand
  • Introduction to basic measurement fundamentals.
  • How to setup and apply measurements with spectrum analyzer, oscilloscopes, VNA’s and power supplies to the DUT.
  • Initial board-bring-up, power rail and current draw measurements.
  • Total and individual channel bandwidth measurements
  • Signal integrity measurements including cable loss and distance to fault measurements
  • Bus decoding and serial data measurements, including data analysis across different areas of the DUT and across the time and frequency domain.

Streamline Flexible System Designs with RF Data Converters, Del Jones & Michelle Viani; Sponsored by Analog Devices, Inc.
The latest RF ADC and DAC products are highly integrated and versatile components that support a large variety of applications and system designs with their digital signal processing feature sets. This short course will explore a variety of different applications and system requirements that RF GSPS converters can support with their integrated digital functions to ease the system design complexities. It will cover examples of various radio architectures and communication systems including Point-to-Point and E-band communication systems, IF/RF transmit and receiver designs for multiband radios and observation (DPD) paths, as well as radar and instrumentation applications.

  • Topic 1: System Level RF Signal Chain--This topic will look first at the system level RF signal chain and how RF converters are simplifying these system architectures in various application spaces.
  • Topic 2: Utilizing the Full Potential of the Converter (RF DAC and RF ADC DSP Details)--This topic will give more specific examples and system use cases for the DSP features of RF converters. The first part will focus on the DAC DSP features such as the use of channelizers and NCO upconverter blocks for system frequency planning. The second part will focus on the ADC DSP features such as the DDC downconverter blocks and frequency planning of a receiver.
  • Topic 3: Building the Right Communication System for the Application--This topic will provide a closer look at the support circuitry around the RF converter and provide specific examples for optimizing the design of the power distribution network, clock distribution, and analog front-end amplifier/filtering designs.