EDI CON USA 2018 Call For Abstracts

Important Dates

  • May 31, 2018 – Abstracts due
  • July 6, 2018 – Notice of acceptance
  • August 13, 2018– Paper Due (MS Word or Text)
  • October 1, 2018 –Slides (PDF)
  • October 17-18, 2018 – EDI CON USA Santa Clara, CA



EDI CON USA brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, computer, consumer electronics, aerospace, and medical industries.

Drawing attendees from both the analog and digital spheres, EDI CON fosters synergy, enabling designers to see techniques and technologies used in other applications that can be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification.

Technical Sessions

The EDI CON technical sessions are educational, providing practical information on how to address today’s design challenges using available materials, tools, products, and techniques. Divided into technical tracks, the 30-minute sessions are based on peer-reviewed abstracts and papers that have been evaluated by the EDI CON Technical Advisory Committee or from invited contributors. The technical tracks focus on a range of high frequency and high-speed electronic design issues from modeling and design to characterization and system integration.

Selecting a Topic
Authors begin the paper submission process by selecting a topic from one of the following technology areas:

  • RF & Microwave Design
  • Mobile Front End Design
  • Low Power RF & IoT
  • 5G Advanced Communications
  • Broadband Networks
  • Radar & Defense
  • Amplifier Design
  • Signal Integrity
  • Power Integrity
  • Simulation & Modeling
  • Test & Measurement


Submitting an Abstract
Once you’ve selected a category, the next step is to submit an abstract (and optional preliminary paper) describing a proposed technical session relating to your work in RF/microwave or high-speed digital design HERE.

To be considered, the abstract must provide a sufficient level of technical detail for the Technical Advisory Committee. To be accepted, submissions must be high quality and comprehensive, aimed at advancing the knowledge of attendees. Submissions will be evaluated per the criteria described below.

Evaluation Criteria
The EDI CON Technical Advisory Committee http://www.ediconusa.com/commitee.asp evaluates submissions based on quality, relevance, impact, and originality. Note that while prospective authors are welcome to reference products in a design case study or as a proof of concept for a design methodology, overt commercial content is NOT acceptable in session proposals.

•      Quality - Abstracts and papers should be well organized and easily understood.
•      Relevance - The proposed paper should be highly relevant to the interests of the EDI CON audience.
•      Impact - EDI CON papers should contribute to the educational mission of EDI CON, furthering the technical expertise of conference delegates. Submissions reporting on important results, methodologies or case studies of special significance will be considered favorably.
•      Originality - Reports on new design methodologies, case studies for innovative designs or other novel results contribute to the EDI CON goal of providing a high-quality educational program for practicing engineers. Papers on “classical” topics that help educate delegates on fundamental concepts, especially in new areas of interest will also be viewed favorably.

NOTE: Product promotion is not permitted in EDI CON technical sessions. Product promotion in a paper proposal will lead to rejection of the proposal. Product promotion in a paper or presentation may lead to requests for revision, the removal of promotional language from the paper and presentation by the conference organizers, or removal of the paper from the program. (It is acceptable to use a product in a design case study or as a proof of concept for a design methodology.)

Final Paper & Presentation Submissions
If a proposal is accepted, the author is required to submit a presentation and paper (required) by the final materials deadline. Presentations and papers will be available to all EDI CON conference delegates in the technical proceedings. All papers submitted by the final materials deadline are eligible for an EDI CON USA Outstanding Paper Award, as determined by the Technical Advisory Committee. They are also eligible for publication online in the Microwave Journal and/or the Signal Integrity Journal.

Technical papers should not exceed 12 pages (there is no prescribed paper template). They may contain mathematical formulas (any derivations of which should be placed in appendices). Presenters should use the speaker template found in the speaker center on the EDI CON USA website to create their presentations.

Speaker Benefits & Responsibilities
If accepted into the program, speakers will receive complimentary admission to all technical sessions, workshops, and panels. If a speaker must cancel his or her presentation, conference management expects the speaker to offer a substitute speaker from his or her work group or company.

Papers accepted by EDI CON will appear in the conference proceedings provided to delegates and made available through purchase from Microwave Journal and EDI CON. Accepted papers are eligible for publication by Microwave Journal, Signal Integrity Journal, and/or Microwave Journal China, as well as the EDI CON Outstanding Paper Award.

About the Technical Advisory Committee
The EDI CON Technical Advisory Committee (TAC) consists of designers, programmers, and engineers from the RF/microwave and high-speed digital design industries. They are well-recognized for their technical leadership and advanced expertise in their respective fields.

The committee, with the guidance of the technical program advisors and conference management, is responsible for the intellectual design and abstract solicitation for the conference. They provide valuable peer reviews of abstracts and papers submitted in their areas of expertise, and recommend the sessions for inclusion in the final EDI CON program.

About the Conference Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China. An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA).

Sample topics by track (event management may move an accepted abstract to a different track).

RF & Microwave Design sample topics:

  • RF/Microwave filter and diplexer design
  • Thermal effects and proper heat-sinking techniques
  • RF power management
  • Antenna design
  • Combining/dividing structures
  • Oscillator and resonator design
  • Mixer, switch and frequency multiplier/divider design
  • Transmitter/receiver design
  • Patch antennas
  • RF FPGA design

Mobile Front-End Design sample topics:

  • Carrier aggregation (CA)
  • Dual carrier (DC)
  • Licensed assisted access (LAA)
  • MulteFire
  • SAW/TC-SAW/BAW filter technologies

Low Power RF & IoT sample topics:

  • Lower Power RF
  • Ultra-low-power RF
  • Remote sensing
  • M2M
  • Backhaul
  • IoT antenna design

5G Advanced Communications sample topics:

  • Massive MIMO
  • Beamforming simulation
  • Alternative modulation schemes
  • mmWave transceivers
  • Cognitive radio
  • Small cells
  • Backhaul
  • SoC
  • Design antenna modules for 5G

Broadband Networks sample topics:

  • 802.11ac
  • 802.11ax
  • 802.11ad/WiGig
  • CATV
  • FTTH
  • Fixed wireless access (FWA)

Radar & Defense sample topics:

  • Millimeter wave systems for point-to-point radio
  • RADAR systems
  • EW
  • Communications
  • Software defined radio
  • Automatic test systems
  • Radar PA design
  • Automotive radar system design
  • Design of sensors for self-driving vehicles, including radar and lidar

Amplifier Design sample topics:

  • LNA Design
  • Power Amplifier Design
  • Design Optimization for Efficiency and Linearity
  • Linearization and Pre-Distortion Techniques
  • Ultra-sensitive low-noise amplifier design
  • Amplifier testing

Signal Integrity sample topics:

  • Channel optimization for low jitter and BER
  • Common signal integrity
  • Signal integrity benchmarking
  • IBIS/AMI model verification
  • PAM4 channel optimization
  • Test fixture characterization and de-embedding
  • Chip/package/PCB co-design
  • Pin-assignment optmization
  • High-speed connector characterizations and applications
  • High speed memory design
  • SerDes design flows
  • HD signal routing
  • New materials for high-speed designs
  • Channel Metrics: single bit response, S-parameters, eye diagrams and contours, COM, and BER

Power Regulation & Distribution sample topics:

  • Designing power interconects
  • Power distribution and management
  • Power distribution network design methodologies
  • Supply noise modeling and analysis
  • Core logic voltage noise
  • On-die capacitance
  • Die package resonance
  • Decoupling capacitor integration
  • Power distribution network impedance
  • Coupling among power domains
  • Power filters
  • Measuring very low power signals
  • Design and characterization of power sources, DC-DC converters

EMI & EMC sample topics:

  • Modeling for product compliance
  • Mitigating EMI issues
  • Conducted emissions
  • Antenna and probe design
  • Near field/far field effects and measurements
  • Common mode chokes

Simulation & Modeling sample topics:

  • Active Device Modeling
  • Passive Device Modeling and EM Simulations/Optimization
  • Behavioral Models
  • Model Representation in RF Simulation
  • Package Modeling
  • Understanding and Modeling Phase Noise
  • Thermal Modeling/Multi-Physics Analysis

Test & Measurement sample topics:

  • Evaluating Probe Designs & Options
  • Nonlinear Measurements
  • RF Measurement Techniques for High Speed Design
  • Working with S-parameters in the Time Domain
  • Load Pull Techniques
  • Material Characterization
  • Working with Advanced Materials (meta, nano, etc.)
  • Advanced RF/mW Semiconductors (GaN, GaAs, LDMOS, etc.)
  • Anechoic chamber verification
  • Testing satellite system devices
  • OTA and mmWaves measurements
  • Test & Measurement challenges for high speed measurement
  • High-speed calibration techniques
  • Power distribution network measurement techniques
  • Testing sensors for self-driving vehicles