The EDI CON technical program focuses on a range of high-frequency and high-speed electronic design issues ranging from modeling and design to component characterization, system integration, and verification.
The EDI CON technical conference includes:
EDI CON technical sessions offer insights on today’s design challenges using available electronic design tools and techniques. Divided into technical tracks, each session is based on peer-reviewed abstracts and papers that have been selected by the EDI CON Technical Advisory Committee.
The technical program also includes workshops and panel sessions that offer interactive opportunities to explore the technologies and methodologies that are critical to success in today’s electronic designs. Invited keynote speakers include industry executives, industry experts, and leading researchers.
Technical topics include RF and microwave design, high-speed digital design, measurement and modeling, EMC/EMI, system-level measurements and modeling, system engineering, signal integrity, materials, and commercial resources, covering subjects such as amplifier design, signal integrity simulation and measurement, radar, low-power wireless, and 5G.
An EDI CON 2018 conference pass includes keynotes presentations from industry experts, technical presentations, workshops, panel discussions, short courses, an exhibitor showcase, demonstrations, hands-on-training, a poster session, and networking.
The event will be held October 17-19, 2018 at the Santa ClaraConvention Center in Santa Clara, CA.