Welcome to EDI CON USA: Where High Frequency Meets High Speed!

EDI CON USA is first industry event in the USA to bring together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, product demonstrations, training, and learning opportunities. Got a design challenge? Bring it to EDI CON USA and ask your peers and industry experts about it. Chances are, you’ll come away with an entirely new perspective on the problem, and some immediate ways to move forward.


Learn from the best, the brightest, and those actually working on the leading edge, creating the products and enabling the technologies that make communication possible. The EDI CON USA exhibition and conference cover what you need to know: wireless, 5G, IoT, backplane, power integrity, signal integrity, modeling, measurement, radar, autonomous vehicles, sensors, interference, shielding, spectrum control, simulation, verification, and more.

EDI CON is backed by the editorial excellence of the best publications in their fields: Microwave Journal and Signal Integrity Journal. Bringing technical expertise to the desktop, these publications delve into the most technical design challenges that practicing engineers face every day. See it all come to life at EDI CON USA 2017, the only industry event for RF & microwave engineers in the continental US in 2017, and the biggest high-speed design conference on the East Coast. Mark your calendar now for October 17-19 in Santa Clara, CA, for this don’t miss event!

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News

EDI CON USA Announces Winners in Outstanding Paper Awards
September 25, 2017 – Norwood Massachusetts: The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced the winners of its Outstanding Paper Awards for EDI CON 2017. Papers were presented at EDI CON USA, September 11-13 at the Hynes Convention Center in Boston, MA.
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EDI CON USA Announces Finalists in Outstanding Paper Awards
September 6, 2017 – Norwood Massachusetts: The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced the finalists in its Outstanding Paper Awards for 2017. Papers will be presented at EDI CON USA, September 11-13 at the Hynes Convention Center in Boston, MA. The Outstanding Paper Awards ceremony will announce the winners and take place at 4:30 PM on Wednesday, September 13th in the Frequency Matters Theater on the show floor.
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EDI CON USA Returns to Boston in 2 Weeks with Powerful Education and Keynotes From Scott McMorrow, Dr. Thomas Cameron and Faride Akretch
August 29, 2017 – Norwood Massachusetts: To add to its high-quality line-up of education, the Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced today its plenary keynote speakers at EDI CON USA, September 11-13 at the Hynes Convention Center in Boston, MA.
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