EDI CON USA is first industry event in the USA to bring together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, product demonstrations, training, and learning opportunities. Got a design challenge? Bring it to EDI CON USA and ask your peers and industry experts about it. Chances are, you’ll come away with an entirely new perspective on the problem, and some immediate ways to move forward.
Learn from the best, the brightest, and those actually working on the leading edge, creating the products and enabling the technologies that make communication possible. The EDI CON USA exhibition and conference cover what you need to know: wireless, 5G, IoT, backplane, power integrity, signal integrity, modeling, measurement, radar, autonomous vehicles, sensors, interference, shielding, spectrum control, simulation, verification, and more.
EDI CON is backed by the editorial excellence of the best publications in their fields: Microwave Journal and Signal Integrity Journal. Bringing technical expertise to the desktop, these publications delve into the most technical design challenges that practicing engineers face every day. See it all come to life at EDI CON USA 2017, the only industry event for RF & microwave engineers in the continental US in 2017, and the biggest high-speed design conference on the East Coast. Mark your calendar now for September 11-13 in Boston, MA, for this don’t miss event!
EDI CON Adds IBIS Summit to Its Premier Program Line-Up
August 9, 2017 – Norwood Massachusetts: The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced today that IBIS Open Forum will hold its first, formal IBIS Summit Meeting at EDI CON USA 2017 at the Hynes Convention Center, September 11-13 in Boston, MA.
EDI CON USA 2017 Launches Scholarship Program
August 2, 2017 – Norwood Massachusetts: EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, announces a new scholarship program for university students interested in high frequency or high-speed electronics.
Analog Devices Signs On as Host Sponsor of EDI CON USA 2017
July 31, 2017 – Norwood Massachusetts: The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced today that Analog Devices, Inc. (ADI) is taking on the role of host sponsor of the exhibition and conference program at the Hynes Convention Center, September 11-13 in Boston, MA.