EDI CON USA is first industry event in the USA to bring together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, product demonstrations, training, and learning opportunities. Got a design challenge? Bring it to EDI CON USA and ask your peers and industry experts about it. Chances are, you’ll come away with an entirely new perspective on the problem, and some immediate ways to move forward.
Learn from the best, the brightest, and those actually working on the leading edge, creating the products and enabling the technologies that make communication possible. The EDI CON USA exhibition and conference cover what you need to know: wireless, 5G, IoT, backplane, power integrity, signal integrity, modeling, measurement, radar, autonomous vehicles, sensors, interference, shielding, spectrum control, simulation, verification, and more.
EDI CON is backed by the editorial excellence of the best publications in their fields: Microwave Journal and Signal Integrity Journal. Bringing technical expertise to the desktop, these publications delve into the most technical design challenges that practicing engineers face every day. See it all come to life at EDI CON USA 2018, the only industry event for RF & microwave engineers in the continental US in 2018, and the biggest high-speed design conference on the West Coast. Mark your calendar now for October 17-18 in Santa Clara, CA, for this don’t miss event!
Ransom Stephens and Ovi Jacob Headline EDI CON USA 2018 Plenary Keynotes
August 13, 2018 – Norwood Massachusetts: EDI CON USA, the industry event that brings together RF/microwave and high-speed digital design engineers and system integrators, announces its plenary keynote speakers - Ovi Jacob and Ransom Stephens - for the 2018 conference, which will be held in Santa Clara, CA October 17 and 18. All passholders will be eligible to see these talks, each happening at 11:30AM.
EDI CON USA 2018 Announces Technical Program Chairs
February 28, 2018 – Norwood Massachusetts: Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the industry event that brings together RF/microwave and high-speed digital design engineers and system integrators, is happy to announce its technical program co-chairs for the 2018 USA event.
EDI CON USA 2018 Opens Call for Abstracts
January 29, 2018 – Norwood Massachusetts: The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the industry event that brings together RF/microwave and high-speed digital design engineers and system integrators, has opened the Call for Abstracts for EDI CON USA 2018. Selected papers will be presented at EDI CON USA 2018, held October 17-19, 2018 at the Santa Clara Convention Center, Santa Clara, CA.